Capabilities - LCP/Microelectronics Packaging Molding

Liquid Crystal Polymers (LCP's) have emerged as a preferred resin for the electronic and opto-electronic packaging for its superior moisture barrier properties and ability to fill extremely thin walls and features on ever-decreasing package sizes and matrix has kept pace with advances in this technology. 

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LCP/Microelectronics Packaging Molding

  • Flip chip device
  • LDMOS packages integrating lead-frames and heat sinks
  • Direct chip encapsulation
  • Multi-pin interconnect devices
microelectronic components, open air cavity, open air cavities, open air cavity packages, open-air cavity, open-air cavities, insert molded glass component, low ball housing, LCP packaging, liquid crystal polymer, plated plastics, lcp, ultem, ball-grid, ball grid, ball grid arrays, ball-grid arrays, solder balls, molded-in solder balls, molded solder balls
  • Ball grid arrays incorporating molded-in solder balls