Markets - Electronics
matrix has been producing precision pin grid arrays, sockets and other interconnection devices for many years. In 1969, matrix began molding Integrated Circuit Connector Insulators with up to 40 contact holes in two rows (standard then) and tolerances of +/- 50µm on hole diameters and +/- 125µm on center-line distances. Today we are still among the few manufacturers who can mold insulators with hundreds of contact holes in eight or more rows, holding tolerances of +/- 13µm on contact hole diameters and +/- 50µm on center-line distances.
We have also worked on encapsulation molding programs with customers wishing to eliminate costly potting operations. Disposal of these potting materials is also becoming more of an issue. Whether your interest is in encapsulating circuit boards with discreet components or Hall effect sensors, matrix can assist.
Microelectronics Packaging
We are working with companies to find sealing solutions and cost reductions with near hermetic LCP packaging to eliminate the more expensive ceramic and Kovar packages. We have successfully molded sixteen 0.030" copper spheres into a Ball Grid Array.
